TI Pushes 2.5G In China News from E-InSite
Texas Instruments Inc. (TI) today said it will supply digital signal processor (DSP)and analog chips to four major Chinese telecom firms to manufacture 2.5G phones.
TI will form a joint venture funded and supervised by China’s Ministry ofInformation Industry (MII) with Shenzhen-based ZTE Corp., Xiamen Overseas ChineseElectronic Inc. Ltd. (Xoceco), Beijing Huahong IC Design Corp. and Ningbao Bird Co. Ltd.to boost the technology in what is now the world’s second largest mobile phonemarket.
TI did not reveal the scope of the contract, number of parts to be supplied, norfinancial details, but it did say it would supply DSP-based digital baseband and userservice identity modules.
Internet-enabled, 2.5G wireless handsets run at data rates up to 384kb/sec. with GSMtransceivers and are a transitional step to wireless broadband data (3G) that will enablereal-time video streaming, audio streaming, location-based services and voice recognition.
According to Dataquest, TI has delivered more than 60 percent of the world’sDSP-based digital basebands and analog basebands embedded in digital wireless handsets. TIsees the China deal as more than a bridgehead to prepare the market for 3G rollout.
“These companies will develop products that can help the country move toward moreadvanced wireless services,” said Tom Engibous, TI’s chairman, CEO andpresident, about working with his new Chinese partners.
In the first half of the year, China’s mobile phone users reached 59.3 million andthat market is forecasted to exceed 140 million by 2003, according to MII. Most users areexpected to migrate from existing second generation to 2.5G and from there 3G standardhandsets.
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