Rumors suggest that Apple is planning a major internal hardware update for the iPhone 18 series. A tipster on Weibo (spotted by Wccftech) claims the company will change the packaging on its A20 and A20 Pro chips from Integrated Fan-Out (InFO) to Wafer-level Multi-Chip Module (WMCM).
This change is expected to help the phone manage heat more effectively, offering sustained power efficiency. The improvements will also depend on TSMC’s 2nm N2 process, but the new packaging is key to making this work.
WMCM technology lets the manufacturer tightly integrate various dies. In this new design, components like the CPU, GPU, and NPU sit on separate dies and act autonomously. This gives the system more flexibility by allowing parts to function independently rather than staying locked on a single die.
This helps reduce power consumption and lets the device dissipate heat more efficiently. Better cooling means the processor can maintain high speeds for longer periods without throttling.
According to the Weibo tipster, Apple also plans to keep the vapor chamber cooling solution from the iPhone 17 Pro and Pro Max. Reports indicate that the company will even bring this passive cooling hardware to the folding iPhone.
